1. Introduction-What An Advanced IC Looks Like;Rao,2016
2. Moisture diffusion and heat transfer in plastic IC packages;Tay;IEEE Trans. Compon. Packag. Manuf. Technol. A,1996
3. A J-integral criterion for delamination of bi-material interfaces incorporating hygrothermal stress;Lin;Am. Soc. Mech. Eng. EEP,1997
4. Dynamics of moisture diffusion, hygrothermal stresses and delamination in plastic IC packages;Lin;ASME Adv. Electron. Packag.,1997
5. Influence of temperature, humidity, and defect location on delamination in plastic IC packages;Lin;IEEE Trans. Compon. Packag. Technol.,1999