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Laser additive manufacturing of embedded electronics

  • Published:2017 Issue: Volume: Page:319-350
  • ISSN:
  • Container-title:Laser Additive Manufacturing
  • language:
  • Short-container-title:

Author:

Auyeung R.C.Y.,Kim H.,Mathews S.,Charipar N.,Piqué A.

Publisher

Elsevier

Reference77 articles.

1. Fabrication processes for embedding thin chips in flat flexible substrates;Govaerts;IEEE Transactions on Advanced Packaging,2009

2. System scaling: the next frontier for a new era of electronic systems;Tummala;Chip Scale Review,2015

3. Embedded Passives Technology;Gerke,2005

4. Embedded passives;Lee,2009

5. Ultrathin wafer pre-assembly and assembly process technologies: a review;Marks;Critical Reviews in Solid State and Materials Sciences,2015

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