SOI technology for power management in automotive and industrial applications-Reference-Cited by-同舟云学术

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SOI technology for power management in automotive and industrial applications

Published:2017-02 Issue: Volume:128 Page:3-9
ISSN:0038-1101
Container-title:Solid-State Electronics
language:en
Short-container-title:Solid-State Electronics

Author:

Stork Johannes M.C.,Hosey George P.

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. High voltage SOI devices for automotive applications;Olsson,2006

2. Vertical high voltage devices on thick SOI with back-end trench formation;Heinle,2002

3. S. Bernstein, Auto Semiconductors Report, September 2012.

4. Energy dissipation and transport in nanoscale devices;Pop;Nano Res.,2010

5. Comparison of self-heating effects in bulk-silicon and SOI high-voltage devices;Arnold,1994

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Single-Event Burnout Hardened Super-Junction Trench SOI LDMOS with Additional Hole Leakage Paths;Electronics;2022-11-16

2. Source Underlap—A Novel Technique to Improve Safe Operating Area and Output-Conductance in LDMOS Transistors;IEEE Transactions on Electron Devices;2019-11

3. Silicon-based high sensitivity of room-temperature microwave and sub-terahertz detector;Applied Physics Express;2019-04-15

4. Numerical study on the self-heating effects for vacuum/high-k gate dielectric tri-gate FinFETs;Microelectronics Reliability;2019-04

5. A novel dual trench gate power device by effective drift region structure;Superlattices and Microstructures;2019-01

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