1. Ishimaru K. Future of non-volatile memory -from storage to computing-. IEEE International Electron Devices Meeting (IEDM) 2019:1.3.1-6. DOI:10.1109/IEDM19573.2019.8993609.
2. Bit cost scalable technology with punch and plug process for ultra high density flash memory;Tanaka,2007
3. Pipe-shaped BiCS flash memory with 16 stacked layers and multi-level-cell operation for ultra high density storage devices;Katsumata;Symposium VLSI Technol,2009
4. Multi-layered vertical gate NAND flash overcoming stacking limit for terabit density storage;Kim;Symposium VLSI Technol,2009
5. Vertical cell array using TCAT(Terabit Cell Array Transistor) technology for ultra high density NAND flash memory;Jang;Symposium VLSI Technol,2009