Author:
Ruddell F.H.,Suder S.L.,Bain M.F.,Montgomery J.H.,Armstrong B.M.,Gamble H.S.,Denvir D.,Casse G.,Bowcock T.,Allport P.P.,Marczewski J.,Kucharski K.,Tomaszewski D.,Niemiec H.,Kucewicz W.
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. The SUCIMA project: a status report on high granularity dosimetry and proton beam monitoring;Caccia;Nucl Instrum Meth A,2006
2. Monolithic active pixel sensor realized in SOI technology – concept and verification;Niemiec;Microelectron Reliab,2005
3. Arai Y. Electronics and sensor study with the OKI SOI process. In: Topical workshop on electronics for particle physics. Prague; 2007.
4. Fabrication of sub-micron active layer SSOI substrates using ion splitting and wafer bonding technologies;Ruddell;Electrochem Soc Proc,2003
5. Technology development for SOI monolithic pixel detectors;Marczewski;Nucl Instrum Meth A,2006
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献