Investigation of electrical characteristics of flexible CMOS devices fabricated with thickness-controlled spalling process-Reference-Cited by-同舟云学术

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Investigation of electrical characteristics of flexible CMOS devices fabricated with thickness-controlled spalling process

Published:2020-11 Issue: Volume:173 Page:107901
ISSN:0038-1101
Container-title:Solid-State Electronics
language:en
Short-container-title:Solid-State Electronics

Author:

Park Honghwi,Lim Changhee,Noh Yeho,Lee Chang-Ju,Won Heungsup,Jung Jaedong,Choi Muhan,Kim Jae-Joon,Yoo Hocheon,Park Hongsik

Funder

National Research Foundation of Korea

MSIT

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference53 articles.

1. Epidermal electronics;Kim;Science,2011

2. Rugged and breathable forms of stretchable electronics with adherent composite substrates for transcutaneous monitoring;Jang;Nat Commun,2014

3. A wearable chemical-electrophysiological hybrid biosensing system for real-time health and fitness monitoring;Imani;Nat Commun,2016

4. Stretchable active-matrix organic light-emitting diode display using printable elastic conductors;Sekitani;Nat Mater,2009

5. Low-power flexible organic light-emitting diode display device;Kim;Adv Mater,2011

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1. Matched printed carbon nanotube complementary metal-oxide-semiconductor (CMOS) devices for flexible circuits;Carbon;2023-11

2. Electrical Properties of a p‐SnO_x/n‐SnO_x Diode on a Flexible Polyimide Substrate;physica status solidi (a);2023-07-11

3. Layer-resolved release of epitaxial layers in III-V heterostructure via a buffer-free mechanical separation technique;Science Advances;2022-01-21

4. Inkjet-printed low-dimensional materials-based complementary electronic circuits on paper;npj 2D Materials and Applications;2021-11-16

5. Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review;Nanomaterials;2021-03-25

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