A simple and fundamental design rule for resisting delamination in bimaterial structures-Reference-Cited by-同舟云学术

A simple and fundamental design rule for resisting delamination in bimaterial structures

Published:2003-03 Issue:3 Volume:43 Page:487-494
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Moore Thomas D.,Jarvis John L.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

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3. Stresses in bi-metal thermostats;Suhir;ASME J. Appl. Mech.,1986

4. Interfacial stresses in bi-metal thermostats;Suhir;ASME J. Appl. Mech.,1989

5. Realistic modeling of edge effect stresses in bimaterial elements;Eischen;ASME J. Electron Packaging,1990

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