Author:
Swanson Dale W,Enlow Leonard R
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference3 articles.
1. Internal Test Report, 12 November, 1997
2. Chung KKT, Dreier G, Avery E, Boyle A, Koehn W, Govaert G, Theunissen D, Genk NV. Tack-free film adhesives. Hybrid circuit technology, May 1990 (reprint)
3. AI Technology Catalog, p. I-1
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