Author:
Beaudoin F,Saviot F,Lewis D,Perdu P,Salin F
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Failure Analysis from Back Side of Die;Wu,1996
2. FLIP-Chip arid “Backside” Techniques;Barton;Microelectronics Reliability,1999
3. Infrared Laser Microscopy of Structures on Heavily Doped Silicon;Joseph,1992
4. Package Reliability;Salagoity;Tutorial ESREF,1999
5. Review of Sample Backside Preparation Techniques for VLSI;Perdu,2000
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献