New assembling technique for BGA packages without thermal processes

Author:

Videkov Valentin,Tzanova Slavka,Arnaudov Radosvet,Iordanov Nikolai

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Reports on the system packaging committee of the IEEE;Balde;IEEE CPMT Newslett,1999

2. Wassing RJK, Verguld MMF. Manufacturing techniques for surface mounted assemblies. Port Erin, Isle of Man: Electrochemical Publications Ltd, 1995

3. Davidson E. Packaging is the mouse that can not roar. Keynote presentation at IEEE System Packaging Workshop, 19–21 May, 1998; IEEE CPMT Newsletter 21(3):8–9

4. Aghazadeh M. Intel packaging strategy. Proc IEEE System Packaging Workshop, South Padre Island, 1998

5. Darbha K, Okura JH, Dasgubta A. Impact of underfill filler particles on reliability of flip-chip interconnects. IEEE Trans. Components Packaging and Manufacturing Technologies – Part A 1998;21(2):275–79

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