Reliability testing of high-power multi-chip IGBT modules-Reference-Cited by-同舟云学术

Reliability testing of high-power multi-chip IGBT modules

Published:2000-08 Issue:8-10 Volume:40 Page:1659-1663
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lefranc G.,Licht T.,Schultz H.J.,Beinert R.,Mitic G.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Application of high-power IGBT modules;Hierholzer,1996

2. Hamidi, A. et al., “Reliability of high-power IGBT modules: reliability testing”, Proc. EPE 97, Trondheim

3. Berg, H., Wolfgang, E., “Advanced IGBT modules for railway traction applications: Testing for thermal fatigue effects due to traction cycles”, Proc. ESREF 98, Copenhagen

4. Reliability of AlN substrates and their solder joints in IGBT power modules;Mitic,1999

5. Sommer, K.H. et al., “Multi-chip high-power IGBT modules for traction and industrial application”, Proc. EPE97, Trondheim

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