Flip chips and acoustic micro imaging: An overview of past applications, present status, and roadmap for the future-Reference-Cited by-同舟云学术

Flip chips and acoustic micro imaging: An overview of past applications, present status, and roadmap for the future

Published:2000-08 Issue:8-10 Volume:40 Page:1539-1543
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Semmens Janet E.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference4 articles.

1. Resolution of Broadband Transducers in Acoustic Microscopy of Encapsulated ICs - Transducer Selection;Canumalla;IEEE Transactions on Components and Packaging Technology,1999

2. Non-Destructive Investigation of Flip Chip Underfill - A Comparison Between Acoustoand Infrared (IR) Microscopy;Lin,1995

3. Nondestructive Elastic Property Characterization of IC Encapsulants;Canumalla,1997

4. Qualification of Underfill Materials for Flip Chip Assemblies;Becker,1998

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