Validation of radiation hardened designs by pulsed laser testing and SPICE analysis-Reference-Cited by-同舟云学术

Validation of radiation hardened designs by pulsed laser testing and SPICE analysis

Published:1999-06 Issue:6-7 Volume:39 Page:931-935
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Pouget V.,Lewis D.,Lapuyade H.,Briand R.,Fouillat P.,Sarger L.,Calvet M.-C.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Pulsed laser-induced single event upset and charge collection measurements as a function of optical penetration depth;Melinger;J. Appl. Phys.,1998

2. RADON 5-E Portable Pulsed Laser Simulator: Description, Qualification Technique and Results, Dosimetry Procedure;Nikiforov,1996

3. Elaboration of a New Pulsed Laser System for SEE Testing;Pouget,1998

4. SPICE Modeling of the Transient Response of Irradiated MOSFETs;Pouget,1999

5. A NewSPICE Model Dedicated to the Analysis of Transient Response of Irradiated MOSFETS for On-Line Testing;Pouget,1999

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