Single chip bumping and reliability for flip chip processes-Reference-Cited by-同舟云学术

Single chip bumping and reliability for flip chip processes

Published:1999-09 Issue:9 Volume:39 Page:1389-1397
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Klein M.,Oppermann H.,Kalicki R.,Aschenbrenner R.,Reichl H.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Flip chip assemblies using conventionally wire bonding apparatus and commercially available dies;Montgomery,1993

2. Flip chip attachment of silicon and GaAs fine pitch devices as well as inner lead TAB attach using ball bump technology;Eldring,1993

3. Reliability investigations of different bumping processes for flip chip and TAB applications;Jung,1996

4. Mechanisches bumping für die flip chip techik;Eldring,1995

5. The pretreatment of aluminum bondpads for electroless nickel bumping;Ostmann,1993

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