Author:
Wu Y.P.,Alam M.O.,Chan Y.C.,Wu B.Y.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Area array interconnect handbook;Puttlitz,2001
2. Liu J et al. Overview of conductive adhesive joining technology in electronic packaging applications. In: Proc 3rd Adhesive Joining and Coating Technology in Electronics Manufacturing Conf, Binghamton, NY, September 1998. p. 1–18
3. Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism;Rainer;IEEE Trans.––CPMT-A,2000
4. Surface characteristics, reliability and failure mechanisms of tin, copper and gold metallizations;Liu;IEEE Trans.––CPMT-A,1997
5. Vona SA et al. Surface mount conductive adhesives with superior impact resistance. In: Proc 4th Advanced Packaging Materials Conf, Chateau Elan, Braselton, Georgia, March 1998. p. 261–7
Cited by
30 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献