An other way to assess electronics part reliability-Reference-Cited by-同舟云学术

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An other way to assess electronics part reliability

Published:1997-10 Issue:10-11 Volume:37 Page:1449-1452
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Charpenel P.,Cavernes P.,Borowski J.,Chopin JM.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. Comparison of electronics-reliability assessment approaches;Cushing;IEEE Trans. Reliability,1993

2. MIL-HDBK-217F

3. Using Plastic-Encapsulated Microcircuits in high reliability environment;Condra,1994

4. Evaluation of reliability prediction methodologies;Zahid,1993

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A review of reliability prediction methods for electronic devices;Microelectronics Reliability;2002-08

2. Introduction to reliability;Microelectronic Engineering;1999-11

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