High performance microsystem packaging: A perspective-Reference-Cited by-同舟云学术

High performance microsystem packaging: A perspective

Published:1997-10 Issue:10-11 Volume:37 Page:1771-1781
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Romig A.D.,Dressendorfer P.V.,Palmer D.W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. ANSI/IEEE Std 1149.1 IEEE Standard Test Access Port and Boundary-Scan Architecture.

2. Micro-Machined Heat Pipes in Silicon MCM Substrates;Benson,1996

3. mini Ball Grid Array (mBGA) Assembly on Low Cost MCM-L Boards;Chanchani,1997

4. A New mini Ball Grid Array (mBGA) Multichip Module Technology;Chanchani;International Journal of Microcircuits and Electronic Packaging,1995

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