Author:
Bechou L.,Ousten Y.,Tregon B.,Marc F.,Danto Y.,Even R.,Kertesz P.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference5 articles.
1. Chip on Board: Technologies for multichip modules;Lau,1994
2. Failure Analysis of Flip-Chip Interconnections Through Acoustic Microscopy;Diaz de Leon,1996
3. Ultrasonic Microscope Investigations of Die-attach Quality and Correlations with Thermal Resistance;Pfannschmidt;Quality and Reliability International,1992
4. Resolution of scanning ultrasonic imaging systems with arbitrary transducer excitation;Nikoonahad;Revue Phys. Appl.,1985
5. Detection of echoes using time-frequency analysis techniques;Daponte;IEEE Trans. Instrum. and Meas.,1996
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献