Author:
Holm Johan,Åhlfeldt Henrik,Svensson Magnus,Vieider Christian
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Self-aligned flip-chip assembly of photonic devices with electrical and optical connections;Wale;IEEE Trans. Compon., Hybrids, Manuf. Technol.,1990
2. H. Åhlfeldt, J. Holm, S. Lindgren, L. Bäcklin, C. Vieider, S. Nilsson, T. Klinga, M. Nilsson, M. Svensson, O. Steijer, B. Sundström, Passive Alignment of Laser Arrays to Single-Mode Fibers Using Microstructured Silicon Carriers, Proceedings of the International Conference on Optical MEMS and Their Applications (MOEMS97), Nara, Japan, Nov. 18–21, 1997, pp. 155–159.
3. H. Åhlfeldt, J. Holm, S. Lindgren, L. Bäcklin, C. Vieider, T. Klinga, B. Kerzar, M. Nilsson, M. Svensson, S. Nilsson, O. Kjebon, R. Schatz, 20 GHz Bandwidth of Lasers Flip-Chip mounted on Microstructured Carriers with Integrated Electrical Waveguides, Proceedings of the 24th European Conference on Optical Communication (ECOC'98), Madrid, Spain, 1998, pp. 205–206.
4. The packaging of large spot-size optoelectronic devices;Collins;IEEE Trans. Compon., Packag., Manuf., Part B,1997
5. Passively aligned hybrid WDM module integrated with spot-size converter integrated laser diode and waveguide photodiode on PLC platform for fibre-to-the-home;Uchida;Electron. Lett.,1996
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献