Author:
Krassow H,Campabadal F,Lora-Tamayo E
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. J.W. Knutti, Finding markets for microstructures, Proc. of the SPIE Conf. on Micromachining and Microfabrication Process Technol. IV, SPIE Vol. 3511, Santa Clara, CA, USA, Sept. 1998, pp. 17–23.
2. Analytical techniques for examining reliability and failure mechanisms of barrier coating encapsulated silicon pressure sensors exposed to harsh media;Bitko;Proc. SPIE,1996
3. Th. Maudie, D.J. Monk, D. Zehrbach, D. Stanerson, Sensor media compatibility: issues and answers, Proc. Sensors Expo, Anaheim, Ca, USA, April 1996, pp. 215–229.
4. H. Krassow, D. Heimlich, F. Campabadal, E. Lora-Tamayo, Novel packaging technique and its application to a wet/wet differential pressure silicon sensor, Proc. of the 9th Int. Conference on Solid-State Sensors and Actuators, Transducers '97, Chicago, IL, USA, June 1997, pp. 275–278.
5. Photolithographic packaging of silicon pressure sensors;Krassow;Sensors and Actuators A,1998
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献