Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. MEMS post-packaging by localized heating and bonding;Lin;IEEE Trans. Adv. Pack.,2000
2. Formation of silicon–gold eutectic bond using localized heating method;Lin;Jpn. J. Appl. Phys., Part II,1998
3. Localized silicon fusion and eutectic Bonding for MEMS fabrication and packaging;Cheng;IEEE/ASME J. Microelectromechanical Syst.,2000
4. Y.T. Cheng, W.T. Hsu, L. Lin, C.T. Nguyen, K. Najafi, Vacuum packaging technology using localized aluminum/silicon-to-glass bonding, in: Proceedings of the IEEE Micro-Electro Mechanical Systems Conference, Interlaken, Switzerland, January 2001, pp. 18–21.
5. G.H. He, L. Lin, Y.T. Cheng, Localized CVD bonding for MEMS packaging, in: Proceedings of the 10th International Conference on Solid-State Sensors and Actuators, Transducers’99, Technical Digest, Sendai, Japan, June 1999, pp. 1312–1315.
Cited by
76 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献