Novel surface-micromachined low-power fuses for on-chip calibration-Reference-Cited by-同舟云学术

Novel surface-micromachined low-power fuses for on-chip calibration

Published:2002-04 Issue: Volume:97-98 Page:173-178
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Maier-Schneider Dieter,Kolb Stefan,Winkler Bernhard,Werner Wolfgang M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. C. Brown, Alternatives to Laser Trim: Zapping Zeners, Blowing Fuse Links, in: Electronics Test, September 1989, pp. 62–70.

2. S. Das, S. K. Lahiri, Transient Response of Polysilicon Fuse-Links for Programmable Memories and Circuits, Semiconductor Devices, Vol. 2733, Proc. Spie., Narosa Publishing House, New Delhi, 1994, pp. 232–234.

3. A large-bias conduction model of polycrystalline silicon films;Das;IEEE Trans. Electron. Devices,1994

4. Programming mechanism of polysilicon resistor fuses;Greve;IEEE Trans. Electron. Devices,1982

5. Absence of oxidation in polysilicon fuse links;Greve;J. Electrochem. Soc.,1983

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An SOI-based post-fabrication process for compliant MEMS devices;Journal of Micromechanics and Microengineering;2024-03-12

2. Thin-Film Micro-Fuse with a Novel Structure Prepared by Ag Vapor Deposition Modulation Based on Organic Photochromism;Applied Physics Express;2013-09-01

3. Electro-thermally induced structural failure actuator (ETISFA) for implantable controlled drug delivery devices based on Micro-Electro-Mechanical-Systems;Lab on a Chip;2010

4. Fuse-tethers in MEMS;Journal of Micromechanics and Microengineering;2006-01-25

5. Nanometre gaps in gold wires are formed by thermal migration;Nanotechnology;2005-06-07