Author:
Matsumoto Y,Shimada T,Ishida M
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Polysilicon integrated microsystems: technologies and applications;Howe;Sensors and Actuators A,1996
2. V.M. Mcneil, M.J. Novack, M.A. Schmidt, Design and Fabrication of Thin-film Microaccelerometers using Wafer Bonding, Proc. 7th Int. Conf. Solid State Sensors and Actuators (Transducers'93), 1993, pp. 822–825.
3. A capacitive accelerometer using SDB-SOI structure;Mastumoto;Sensors and Actuators A,1996
4. T.J. Brosihan, J.M. Bustillo, A.P. Pisano, R.T. How, Embedded Interconnect and Electrical Isolation for High-aspect-ratio, SOI Inertial Instruments, Proc. 1997 Int. Conf. Solid State Sensors and Actuators (Transducers'97), 1997, pp. 637–640.
5. Critical review: adhesion in surface micromechanical structures;Maboudian;J. Vac. Sci. Technol. B,1997
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献