The Simulation Study on Internal Stress in Multilayer Thermistors during Soldering Process
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Published:2020-12
Issue:
Volume:2
Page:124-128
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ISSN:2589-2088
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Container-title:Solid State Electronics Letters
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language:en
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Short-container-title:Solid State Electronics Letters
Author:
Yu NamCholORCID,
Kim JuSong,
Li Yong Ho,
Pak Song Chol