Application of SiO2 aerogel film with low dielectric constant to intermetal dielectrics-Reference-Cited by-同舟云学术

Application of SiO2 aerogel film with low dielectric constant to intermetal dielectrics

Published:1997-10 Issue: Volume:308-309 Page:490-494
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Jo Moon-Ho,Hong Jung-Kyun,Park Hyung-Ho,Kim Joong-Jung,Hyun Sang-Hoon,Choi Se-Young

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference14 articles.

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3. B. Zhao, S.-Q. Wang, S. Anderson, R. Lam, M. Fiehig, P.K. Vasudev, T.E. Seidel, in: K.N. Tu, J.W. Mayer, J.M. Poate, L.J. Chen (Eds.), Advanced Metallization for future VLSI, Proc. Mat. Res. Soc Symp., 427 (1996) 415.

4. C.B. Case, A. Kornblit, K.S.Y. Lau, N.H. Hendricks, Proc. International IEEE VLSI Multilevel Interconnection Conference, 104 (1995) 116.

5. S.P. Murarka, Sol. State. Tech. Mar., (1996) 83.

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