Effect of the pressure on the chemical vapor deposition of copper from copper hexafluoroacetylacetonate trimethylvinylsilane

Author:

Lee Won-Jun,Rha Sa-Kyun,Lee Seung-Yun,Kim Dong-Won,Park Chong-Ook

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Advanced Metallization for ULSI Applications in 1993;Suguro,1994

2. Tungsten and Other Advanced Metals for VLSI Applications 1990;Murarka,1991

3. Copper-Based Metallization for ULSI Applications

4. Copper-Based Metallization in ULSI Structures: Part II: Is Cu Ahead of Its Time as an On-Chip Interconnect Material?

5. Proc. 8th International IEEE VLSI Interconnection Conf.;Norman,1991

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