Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. R.L. Cormia, et al., US Patent 4,046,659 (1977).
2. A quasi‐direct‐current sputtering technique for the deposition of dielectrics at enhanced rates
3. Proc. 3rd ISSP;Scholl,1995
4. Proc. 3rd ISPP Tokyo;Schiller,1995
Cited by
30 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献