Design and performance of low-thermal-resistance, high-electrical-isolation heat intercept connections-Reference-Cited by-同舟云学术

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Design and performance of low-thermal-resistance, high-electrical-isolation heat intercept connections

Published:1995-11 Issue:11 Volume:35 Page:829-832
ISSN:0011-2275
Container-title:Cryogenics
language:en
Short-container-title:Cryogenics

Author:

Niemann R.C.,Gonczy J.D.,Phelan P.E.,Nicol T.H.

Publisher

Elsevier BV

Subject

General Physics and Astronomy,General Materials Science

Reference9 articles.

1. Design, construction and performance of a post-type cryogenic support;Niemann;Adv Cryog Eng,1985

2. Model SSC dipole magnet cryostat assembly at Fermilab;Niemann,1989

3. Cryogenic support thermal performance measurements;Gonczy;Adv Cryog Eng,1987

4. Design and analysis of the SSC dipole magnet suspension system;Nicol,1989

5. High-temperature superconducting current leads;Hull;IEEE Trans Appl Supercond,1993

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1. Large enhancement of thermal conductance at ambient and cryogenic temperatures by laser remelting of plasma-sprayed Al2O3 coatings on Cu;Materials Research Bulletin;2021-11

2. Experimental investigation of thermal contact conductance at low temperature based on fractal description;International Communications in Heat and Mass Transfer;2006-08

3. Thermal contact conductance across filled polyimide films at cryogenic temperatures;Cryogenics;1999-10

4. Thermal boundary resistance of mechanical contacts between solids at sub-ambient temperatures;Journal of Physics D: Applied Physics;1999-01-01

5. Thermal Resistance Across a Copper/Kapton/Copper Interface at Cryogenic Temperatures;Advances in Cryogenic Engineering;1998

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