Interface morphology evolvement and microstructure characteristics of hypoeutectic Cu–1.0 wt%Cr alloy during unidirectional solidification
Author:
Publisher
Informa UK Limited
Subject
General Materials Science
Link
http://www.tandfonline.com/doi/pdf/10.1016/j.stam.2005.09.003
Reference15 articles.
1. The microstructure and properties of water atomized and extruded CuCr alloy powders
2. Damage and failure during creep of a copper-chromium in-situ composite
3. Stability of a Planar Interface During Solidification of a Dilute Binary Alloy
4. Ageing characteristics of Cu–Cr in-situ composite
5. Enhanced strength in high conductivity copper alloys
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3. Solid-liquid interface morphology of white carbide eutectic during directional solidification;Archives of Metallurgy and Materials;2017-03-01
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