Micropen Printing of Electronic Components-Reference-Cited by-同舟云学术

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Micropen Printing of Electronic Components

Published:2002 Issue: Volume: Page:229-259
ISSN:
Container-title:Direct-Write Technologies for Rapid Prototyping
language:
Short-container-title:

Author:

Clem Paul G.,Bell Nelson S.,Brennecka Geoff L.,Dlmos Duane B.,King Bruce H.

Publisher

Elsevier

Reference49 articles.

1. Dynamic Pen Control in a Synchronous Positive Displacement CAD/CAM Thick Film Writing System;Drumheller,1982

2. Rheology and printing of high definition thick-film inks;Baudry;Intl. J. Hybrid Microelectronics,1982

3. Analytical Engineering Model of the Screen Printing Process: Part I;Riemer;Solid State Technology,1988

4. Analytical Engineering Model of the Screen Printing Process, Part II;Riemer;Solid State Technology,1988

5. A Study of the Off-Contact Screen Printing Process-Part 1: Model of the Printing Process and Some Results Derived From Experiments;Owczarek;IEEE Trans. On Components, Hybrids, and Manufacturing Technology,1990

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Printing Characteristics and Performance of Polymer Thick Film Inks for Direct Write Applications;Proceedings of the 36th International MATADOR Conference;2010

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