In vitro and in vivo studies of ultrafine-grain Ti as dental implant material processed by ECAP-Reference-Cited by-同舟云学术

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In vitro and in vivo studies of ultrafine-grain Ti as dental implant material processed by ECAP

Published:2016-10 Issue: Volume:67 Page:34-41
ISSN:0928-4931
Container-title:Materials Science and Engineering: C
language:en
Short-container-title:Materials Science and Engineering: C

Author:

An Baili,Li Zhirui,Diao Xiaoou,Xin Haitao,Zhang Qiang,Jia Xiaorui,Wu Yulu,Li Kai,Guo Yazhou

Funder

Shaanxi Province Science and Technology Research and Development Program

Publisher

Elsevier BV

Subject

Biomaterials,Bioengineering,Mechanics of Materials

Reference43 articles.

1. Current trends in dental implants;Gaviria;Journal of the Korean Association of Oral & Maxillofacial Surgeons,2014

2. Osseointegrated titanium fixtures in the treatment of edentulousness;Nemark;Biomaterials,1983

3. Increased osteoblast adhesion on nanophase metals: Ti, Ti6Al4V, and CoCrMo;Webster;Biomaterials,2004

4. Response of human bone marrow stromal cells to a novel ultra-fine-grained and dispersion-strengthened titanium-based material;Despang;Acta Biomater.,2010

5. Enhanced osteoblast response to an equal channel angular pressing-processed pure titanium substrate with microrough surface topography;Park;Acta Biomater.,2009

Cited by 47 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Novel Approach to Reducing Spinal Implant-Associated Infections;2024-08-31

2. Effect of ECAP process on deformability, microstructure and conductivity of AA5083 under thermal effect;MATEC Web of Conferences;2024

3. Usability of the ECAP-Conform process for the production of dental implants material;Journal of the Mechanical Behavior of Biomedical Materials;2023-11

4. Investigation of magnetron sputtered nano-silver coating on titanium surface with micro-nanostructure;Surfaces and Interfaces;2023-06

5. Tension-Compression Asymmetry in Ultrafine-grained Commercially Pure Ti Processed by ECAP;Journal of Wuhan University of Technology-Mater. Sci. Ed.;2023-05-25

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