Highly thermally conductive composites with boron nitride nanoribbon array-Reference-Cited by-同舟云学术

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Highly thermally conductive composites with boron nitride nanoribbon array

Published:2024-05 Issue: Volume:488 Page:150915
ISSN:1385-8947
Container-title:Chemical Engineering Journal
language:en
Short-container-title:Chemical Engineering Journal

Author:

Wei Peng,Feng Lei,Chen Qiang,Dong Zhijie,Song Qiang,Tian Rui,Zhang Ruoxi,Guo Liyuan,Xu Dongfang,Hou Mengdan,Song Haojie

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference50 articles.

1. Soft and self-adhesive thermal interface materials based on vertically aligned, covalently bonded graphene nanowalls for efficient microelectronic cooling;Yan;Adv. Funct. Mater.,2021

2. A roadmap review of thermally conductive polymer composites: critical factors, progress, and prospects;Wang;Adv. Funct. Mater.,2023

3. Densely interconnected porous BN frameworks for multifunctional and isotropically thermoconductive polymer composites;Xue;Adv. Funct. Mater.,2018

4. A full-component recyclable epoxy/BN thermal interface material with anisotropy high thermal conductivity and interface adaptability;Liu;Chem. Eng. J.,2023

5. Highly thermally conductive and electrically insulating polydimethylsiloxane composites prepared by ultrasonic-assisted forced infiltration for thermal management applications;Zhang;Compos. B Eng.,2021

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Enhanced intrinsic thermal conductivity of liquid crystalline polyester dispersed films through hydrogen bond interaction;Polymer;2024-09

2. Constructing the Snail Shell-Like Framework in Thermal Interface Materials for Enhanced Through-Plane Thermal Conductivity;ACS Applied Materials & Interfaces;2024-08-29

3. Preparation technologies for polymer composites with high-directional thermal conductivity: A review;Nano Research;2024-08-20

4. Enhanced thermal conductivity of polymeric composites with BN@C hybrid fillers;Journal of Materials Chemistry C;2024

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