Design and synthesis of anhydride-terminated imide oligomer containing phosphorus and fluorine for high-performance flame-retarded epoxy resins-Reference-Cited by-同舟云学术

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Design and synthesis of anhydride-terminated imide oligomer containing phosphorus and fluorine for high-performance flame-retarded epoxy resins

Published:2023-04 Issue: Volume:461 Page:142063
ISSN:1385-8947
Container-title:Chemical Engineering Journal
language:en
Short-container-title:Chemical Engineering Journal

Author:

Liu Xing,Zhou Jianjun,Wu Minghong,Liu Shumei,Zhao Jianqing

Funder

South China University of Technology

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry

Reference79 articles.

1. Synthesis and application of epoxy resins: A review;Jin;J. Ind. Eng. Chem.,2015

2. Recent advances in epoxy resin, natural fiber-reinforced epoxy composites and their applications;Saba;J. Reinf. Plast. Compos.,2015

3. Polyhedral Oligosilsesquioxane-Modified Boron Nitride Nanotube Based Epoxy Nanocomposites: An Ideal Dielectric Material with High Thermal Conductivity;Huang;Adv. Funct. Mater.,2013

4. A novel UV-curable epoxy resin modified with cholic acid for high-frequency dielectric packaging;Liu;Prog. Org. Coat.,2022

5. Advances on Thermally Conductive Epoxy-Based Composites as Electronic Packaging Underfill Materials—A Review;Wen;Adv. Mater.,2022

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Synthesis of phosphorus fluorine containing polymers for flame-retardant, low surface energy and good dielectric performance epoxy resin electronic packaging materials;Polymer Degradation and Stability;2024-11

2. Advancing flame retardancy, mechanical properties, and hydrophobicity of epoxy resins through bio-based cinnamaldehyde derivative;Journal of Industrial and Engineering Chemistry;2024-11

3. Characteristics of Colorless Fluorinated Imide-Based Oligomers for UV-Curing Coatings;ACS Applied Polymer Materials;2024-09-04

4. Phosphononitrile based bismaleimide electronic packaging substrate with both fire safety and dielectric properties: Assisting 5G communication;Composites Part B: Engineering;2024-07

5. Preparation of Structural Heat-and-Radiation-Resistant Integrated Epoxy by Constructing a Carborane-Hybridized Cross-Linked Network;Macromolecules;2024-06-25

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