Dual 3D networks of graphene derivatives based polydimethylsiloxane composites for electrical insulating electronic packaging materials with outstanding electromagnetic interference shielding and thermal dissipation performances-Reference-Cited by-同舟云学术

Dual 3D networks of graphene derivatives based polydimethylsiloxane composites for electrical insulating electronic packaging materials with outstanding electromagnetic interference shielding and thermal dissipation performances

Published:2023-04 Issue: Volume:462 Page:142017
ISSN:1385-8947
Container-title:Chemical Engineering Journal
language:en
Short-container-title:Chemical Engineering Journal

Author:

Anand Sebastian^ORCID,Vu Minh Canh,Mani Dineshkumar,Kim Jun-Beom,Jeong Tae-Hyeong,Islam Md. Akhtarul,Kim Sung-Ryong

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,General Chemical Engineering,Environmental Chemistry,General Chemistry

Reference68 articles.

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4. Electromagnetic interference shielding epoxy composites with satisfactory thermal conductivity and electrical insulation performance enabled by low-melting-point alloy layered structure;Zhang;Compos. B Eng.,2022

5. Thermal conductivity of polymer-based composites: Fundamentals and applications;Chen;Prog. Polym. Sci.,2016

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