Chemical etching of Cu-ETP copper-Reference-Cited by-同舟云学术

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Chemical etching of Cu-ETP copper

Published:2005-05 Issue: Volume:162-163 Page:275-279
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Çakır O.,Temel H.,Kiyak M.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference25 articles.

1. J.W. Dini, Fundamentals of chemical machining, American Machinist, Special Report: 768, 128 (1984) 113–128.

2. Chemical Milling;Harris,1974

3. The Principles and Practice of Photochemical Machining and Photoetching;Allen,1986

4. Chemical machining with ferric chloride etchant;Ueda;Corros. Eng.,1989

5. Chemical milling;Van Deusen;Sci. Am.,1958

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4. Influence of flux agent composition on the ionization potential in A-TIG welding of the electrolytic tough pitch copper (Cu-ETP) sheets;Journal of Materials Research and Technology;2024-03

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