Computer-based monitoring of the polishing processes using LabView-Reference-Cited by-同舟云学术

Computer-based monitoring of the polishing processes using LabView

Published:2009-11 Issue:20 Volume:209 Page:6039-6047
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Klocke F.,Dambon O.,Schneider U.,Zunke R.,Waechter D.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference22 articles.

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2. Chinn, R.E., 2002. Ceramography. ASM International, Materials Park.

3. Colloidal Dynamics Ltd., 2000. The CMP Slurry Monitor. Australia.

4. Dambon, O., 2005. Das Polieren von Stahl für den Werkzeug- und Formenbau. Ph.D. thesis. RWTH Aachen, Germany.

5. Measurement and interpretation of electrokinetic phenomena;Delgado;Pure Appl. Chem.,2005

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