Author:
Kim W.B.,Min B.-K.,Lee S.J.
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference11 articles.
1. S.H. Li, R.O. Miller, Chemical Mechanical Polishing in Silicon Processing, Academic Press, San Diego, 2000.
2. Pad conditioning in chemical mechanical polishing;Hooper;J. Mater. Process. Technol,2002
3. Improved planarization for STI with fixed abrasive technology;Vo;Solid State Technol,2000
4. Abrasive-free polishing for copper damascene interconnection;Kondo;J. Electrochem. Soc,2000
5. Progress update in magnetorheological finishing;Kordonski;Int. J. Mod. Phys. B,1999
Cited by
23 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献