Micro-machinability of monocrystal silicon by direct etching using excimer laser-Reference-Cited by-同舟云学术

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Micro-machinability of monocrystal silicon by direct etching using excimer laser

Published:2008-05 Issue:1-3 Volume:200 Page:390-397
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Yuan Weizheng,Ma Binghe

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference21 articles.

1. Excimer laser technology opens doors for industrial innovations;Basting;Photon. Spectra,1996

2. Stereo laser micro-machining of silicon;Bloomstein;Appl. Phys. Lett.,1992

3. Excimer laser ablation and etching;Brannon;IEEE Circuits Device,1990

4. Brannon, J.,1993. Excimer Laser Ablation and Etching. AVS Monograph Series M-10. Amercian Vacuum Society, New York.

5. Laser Processing and Analysis of Materials;Duley,1983

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2. On Generation of Micro-Feature on Silicon with an Industrial Laser;Materials Science Forum;2013-11

3. Experimental Micromachining of Silicon with Nd-YAG Laser;Applied Mechanics and Materials;2011-07

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