Functional prototype development of multi-layer board (MLB) using rapid prototyping technology-Reference-Cited by-同舟云学术

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Functional prototype development of multi-layer board (MLB) using rapid prototyping technology

Published:2007-06 Issue: Volume:187-188 Page:619-622
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Im Y.G.,Cho B.H.,Seo S.H.,Son J.H.,Chung S.I.,Jeong H.D.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference6 articles.

1. Development of a direct metal freeform fabrication technique using CO2 laser welding and milling technology;Choi;J. Mater. Process. Technol.,2001

2. Seoul, 3D laminating systems;Jeong;Sungan-dang,1996

3. Rapid prototyping issues in 21st century;Kochan;Comput. Ind.,1993

4. Printed Circuit Boards;Heiserman,1983

5. B.L. Ahn, Printing Technologies, Seoul, Sejinsa, 1983, 55–79.

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