Author:
Srivastava V.C,Schneider A,Uhlenwinkel V,Ojha S.N,Bauckhage K
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites
Reference13 articles.
1. High strength high electrical conductivity copper alloy for high pin count lead frames;Yamamoto;Hitachi Cable Rev.,2000
2. Thermomechanical processing of Cu–Ni–Si–Cr–Mg alloy;Rdzawski;Mater. Sci. Technol.,1993
3. G. Ghosh, J. Miyake, M.E. Fine, The systems based design of high strength high conductivity alloy, J. Met. 49 (3) (1997) 56–60.
4. Cu–Ni–Si–Zn–Sn–Mg alloy with high strength, good bending workability and excellent stress relaxation resistance;Usami;J. Jpn. Copper Brass Res. Assoc.,2001
5. Precipitate structure in Cu–Ni–Si alloy;Lockyer;J. Mater. Sci.,1994
Cited by
47 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献