Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference12 articles.
1. A.H. Kumar, P.W. Mcmillan, R.R. Tummala, Glass-ceramics structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper [P], U.S. Patent 4,301,324 (November 17, 1981).
2. Effect of size and morphology of particulate SiC dispersions on fracture behaviour of Si3N4 without sintering aids
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