The relationship between hot ductility and intergranular fracture in a CuSn6P alloy at elevated temperatures-Reference-Cited by-同舟云学术

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The relationship between hot ductility and intergranular fracture in a CuSn6P alloy at elevated temperatures

Published:2005-05 Issue: Volume:162-163 Page:392-401
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Ozgowicz W.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference11 articles.

1. Improvement in Hot Ductility in a Cu-4.4 mol%Sn Alloy by Adding a Small Amount of Third Elements

2. R. Nowosielski, Zeszyty Nauk. Pol. Śl., Mechanika, z.135, Gliwice, 2000 (in Polish).

3. W. Ozgowicz, Zeszyty Nauk. Pol. Śl., Mechanika, no. 1632, Gliwice, 2004 (in Polish).

4. M. Tacikowski, These de Doct., ENSMSE, Saint-Etienne, 1986.

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