A high-density, super-high-aspect-ratio microprobe array realized by high-frequency vibration assisted inverse micro w-EDM-Reference-Cited by-同舟云学术

A high-density, super-high-aspect-ratio microprobe array realized by high-frequency vibration assisted inverse micro w-EDM

Published:2017-12 Issue: Volume:250 Page:144-155
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Chen Shun-Tong,Yang Shih-Wei

Funder

Ministry of Science and Technology of the Republic of China

Taiwan

Taiwan Semiconductor Manufacturing Company Limited

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference21 articles.

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3. Development of a novel micro w-EDM power source with a multiple Resistor-Capacitor (mRC) relaxation circuit for machining high-melting point, −hardness and −resistance materials;Chen;J. Mater. Process. Technol.,2017

4. Development of micro co-axial diamond wheel-tool array using a hybrid process of electrochemical co-deposition and RWEDM technique;Chen;J. Mater. Process. Technol.,2012

5. Development of an in-situ high-precision micro-hole finishing technique;Chen;J. Mater. Process. Technol.,2016

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