Physical modelling, numerical simulation and experimental investigation of microfluidic devices with amorphous thermoplastic polymers using a hot embossing process-Reference-Cited by-同舟云学术

Physical modelling, numerical simulation and experimental investigation of microfluidic devices with amorphous thermoplastic polymers using a hot embossing process

Published:2016-03 Issue: Volume:229 Page:36-53
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Cheng Gang,Sahli Mohamed,Gelin Jean-Claude,Barriere Thierry

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference33 articles.

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3. Hot embossing as a method for the fabrication of polymer high aspect ratio structures;Becker;Sensor Actuat. A-Phys.,2000

4. Solid Surface Characterization;Bhushan,2013

5. Thermoplastics and Thermoplastic Composites;Biron,2007

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