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Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads

  • Published:2010-06 Issue:8 Volume:210 Page:1035-1042
  • ISSN:0924-0136
  • Container-title:Journal of Materials Processing Technology
  • language:en
  • Short-container-title:Journal of Materials Processing Technology

Author:

Xu Hui,Liu Changqing,Silberschmidt Vadim V.,Chen Zhong,Wei Jun

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference26 articles.

1. The role of micro-slip in ultrasonic bonding of microelectronic dimensions;Chen;Int. Hybrid Microelectron. Symp.,1972

2. Contact of elastic spheres under an oscillating torsional couple;Deresiewicz;J. Appl. Mech.,1954

3. Wire Bonding in Microelectronics, Materials, Processes, Reliability, and Yield;Harman,1997

4. The ultrasonic welding mechanism as applied to aluminum and gold wire-bonding in microelectronics;Harman;IEEE Trans. Parts, Hybrids, Packag.,1977

5. An experimental model of the microelectronic ultrasonic wire bonding mechanism;Harman,1972

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