Microstructure and mechanical performance of composite joints of sapphire by ultrasonic-assisted brazing-Reference-Cited by-同舟云学术

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Microstructure and mechanical performance of composite joints of sapphire by ultrasonic-assisted brazing

Published:2018-07 Issue: Volume:257 Page:1-6
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Cui Wei,Li Shuqi,Yan Jiuchun,Zhang Xing

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangsu Province

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference19 articles.

1. On the pressure of cavitation bubbles;Brujan;Exp. Therm. Fluid Sci.,2008

2. Study on thermal expansion of zinc-aluminium alloy;Chen;Special Cast. Nonferrous Alloy,1999

3. Strengthening mechanism of nano-Al2O3, particles reinforced Sn3.5Ag0.5Cu lead-free solder;Chuang;J. Mater. Sci.: Mater. Electron.,2011

4. Building a nano-crystalline α-alumina layer at a liquid metal/sapphire interface by ultrasound;Cui;Ultrason. Sonochem.,2015

5. Sapphire: Material, Manufacturing, Applications;Dobrovinskaya,2009

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Acoustic cavitation-induced microstructure evolution in ultrasonically brazed Al/Cu joints using Zn-Al alloy fillers;Ultrasonics Sonochemistry;2024-10

2. Study on wetting mechanism of Sn3Sc alloy on silica and sapphire surfaces;Surfaces and Interfaces;2024-08

3. Joining of SiO2 glass and substrate using In49Sn active solder in air;Journal of Materials Science: Materials in Electronics;2024-01

4. Ni interlayer induced strengthening effect in alumina/alumina joint bonded with Ti/Cu/Ni/Cu/Ti composite foils;Journal of the European Ceramic Society;2023-09

5. High-strength joining of silica glass and 2024 aluminum alloy by ultrasonic-assisted soldering with Sn-Bi low temperature solder;Journal of Manufacturing Processes;2023-09

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