Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints-Reference-Cited by-同舟云学术

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Influence of Cu micro/nano-particles mixture and surface roughness on the shear strength of Cu-Cu joints

Published:2018-07 Issue: Volume:257 Page:250-256
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Zuo Yang,Shen Jun,Xie Jiacheng,Xiang Lu

Funder

Key Industry Technology Innovation Fund of Science and Technology Development Board of Xiangcheng district of Suzhou of China

Science and Technology Project of Beibei district of Chongqing of China

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites

Reference19 articles.

1. Size effect on the melting temperature of gold particles;Buffat;Phys. Rev. A,1976

2. Ceramic Materials: Science and Engineering;Carter,2013

3. Influence of Adherend Surface roughness on the adhesive bond strength;Ghumatkar;Lat. Am. J. Solids Strut.,2016

4. Demonstration and electrical performance of Cu–Cu bonding at 150 °C with Pd Passivation;Huang;IEEE Trans. Electron Devices,2015

5. Effect of oxidation and surface roughness on the shear strength of single-lap-joint adhesively bonded metal specimens by tension loading;Khan;Appl. Adhes. Sci.,2016

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1. Low-temperature copper sinter-joining technology for power electronics packaging: A review;Journal of Materials Processing Technology;2024-11

2. Interface stiffness identification of rough and weak bonded interface using developed ultrasonic reflection phase derivative spectrum;NDT & E International;2024-09

3. Enhancement of Cu-to-Cu bonding property by residual stress in Cu substrate;Materials Characterization;2024-08

4. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging;Journal of Electronic Materials;2024-03-29

5. Enhancement of Cu-to-Cu Bonding Property by Residual Stress in Cu Substrate;2024

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