Author:
Sun Yibo,Luo Yi,Wang Xiaodong
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites
Reference12 articles.
1. A simplified thermoviscoelastic analysis of ultrasonic bonding;Aliosio;SPE Technical papers,1972
2. Micro bonding with non-viscous adhesives;Bohm;Microsystem Technologies,2006
3. Ultrasonic bonding for MEMS sealing and packaging;Kim;IEEE Transactions on Advanced Packaging,2009
4. Low-temperature thermal bonding of PMMA microfluidic chips;Li;Analytical Letters,2005
5. Polymer characterization by ultrasonic wave propagation;Lionetto;Advances in Polymer Technology,2008
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献