Improvement in polishing effect of silicon wafer due to low-amplitude megasonic vibration assisting chemical-mechanical polishing-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Improvement in polishing effect of silicon wafer due to low-amplitude megasonic vibration assisting chemical-mechanical polishing

Published:2019-01 Issue: Volume:263 Page:330-335
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Li Liang^ORCID,He Qing,Zheng Mian,Ren Yi,Li Xiaolong

Funder

elementary research fund of university from department of education of Liaoning province

project of science and technology of Liaoning province

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference18 articles.

1. Particle removal by focused ultrasound;Brereton;J. Sound Vib.,1994

2. The effect of time, temperature and particle size on submicron particle removal using ultrasonic cleaning;Busnaina;Chem. Eng. Commun.,1993

3. CMP challenge below a quarter micron;DeJule;Semicond. Int.,1997

4. High-power ultrasonic processing: recent developments and prospective advances;Gallego-Juárez;Phys. Procedia,2010

5. Power ultrasonic transducers with extensive radiators for industrial processing;Gallego-Juárez;Ultrason. Sonochem.,2010

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Atomic surface of silicon wafers induced by grafted silica nanoparticles and sodium carbonate;Applied Surface Science;2024-08

2. Chemical Effect Mechanism in Chemical Mechanical Polishing of Silicon Wafer;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17

3. Deep insights into interaction behaviour and material removal of β-SiC wafer in nanoscale polishing;Tribology International;2023-08

4. Effect of cations on the improvement of material removal rate of silicon wafer in chemical mechanical polishing;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2023-08

5. Defect-Engineered MnO₂ as Catalyst for the Chemical Mechanical Polishing of Silicon Carbide Wafer;ECS Journal of Solid State Science and Technology;2023-07-01

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3