A reconfigurable test method based on LFSR for 3D stacking integrated circuits

Author:

Tian Chen,Lu Jianyong,Jun Liu,Liang Huaguo,Lu Yingchun,Yi Maoxiang

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Reference20 articles.

1. Design-for-test and test time optimization for 3D SOCs;Roy,2017

2. “Roadmap evolution: From NTRS to ITRS, from ITRS 2.0 to IRDS;Paolo,2017

3. Test-cost modeling and optimal test-flow selection of 3-D-stacked ICs;Agrawal;IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.,2015

4. Handbook of 3D Integration, Volume 1: Technology and Applications of 3D Integrated Circuits;Philip,2011

5. The long road to 3-D integration: Are we there yet;Vucurevich,2007

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